mood Posted February 17, 2021 Share Posted February 17, 2021 Samsung's new HBM-PIM claims to be twice as fast while drawing over 70% less power Samsung - one of the creators of the 3D-stacked High Bandwidth Memory, or HBM - has launched its next innovation in that department with the introduction of its new processing-in-memory (PIM) architecture, which will now add the power of AI into HBM. As the name suggests, PIM or processing-in-memory will bring some sort of programmability within the memory layer with the help of a new embedded "DRAM-optimized" AI engine inside the memory banks. The AI engine, dubbed Programmable Compute Unit (or PCU) will be tasked to move the data between the CPU and memory in a parallelized manner which, in turn, claims to eliminate the inherent bottleneck of the von Neumann architecture. The traditional von Neumann approach sees sequential back-and-forth data movement between the CPU and memory which tends to increase the overall latency and inefficiency of the processing. Samsung says that early testing of the HBM-PIM implementation inside its 2018 'Aquabolt' HBM2 sees a doubling of performance alongside a power reduction of more than 70%. The technology is currently undergoing validatory tests inside AI accelerators from various partners of the company and the South Korean giant expects the validation phase to be complete within the first half of this year. When ready, HBM-PIM can be seamlessly integrated into new and existing systems for use in data centers, high-performance computing (HPC), AI-based mobile applications, etc., with no change necessary in the hardware and software setup. Samsung will share more details on HBM-PIM at the ongoing 2021 International Solid-State Circuits Virtual Conference (ISSCC). Source: Samsung's new HBM-PIM claims to be twice as fast while drawing over 70% less power Link to comment Share on other sites More sharing options...
aum Posted February 17, 2021 Share Posted February 17, 2021 The new architecture will deliver over twice the system performance and reduce energy consumption by more than 70% Samsung Electronics, the world leader in advanced memory technology, today announced that it has developed the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM. The new processing-in-memory (PIM) architecture brings powerful AI computing capabilities inside high-performance memory, to accelerate large-scale processing in data centers, high performance computing (HPC) systems and AI-enabled mobile applications. Kwangil Park, senior vice president of Memory Product Planning at Samsung Electronics stated, “Our groundbreaking HBM-PIM is the industry’s first programmable PIM solution tailored for diverse AI-driven workloads such as HPC, training and inference. We plan to build upon this breakthrough by further collaborating with AI solution providers for even more advanced PIM-powered applications.” Rick Stevens, Argonne’s Associate Laboratory Director for Computing, Environment and Life Sciences commented, “I’m delighted to see that Samsung is addressing the memory bandwidth/power challenges for HPC and AI computing. HBM-PIM design has demonstrated impressive performance and power gains on important classes of AI applications, so we look forward to working together to evaluate its performance on additional problems of interest to Argonne National Laboratory.” Most of today’s computing systems are based on the von Neumann architecture, which uses separate processor and memory units to carry out millions of intricate data processing tasks. This sequential processing approach requires data to constantly move back and forth, resulting in a system-slowing bottleneck especially when handling ever-increasing volumes of data. Instead, the HBM-PIM brings processing power directly to where the data is stored by placing a DRAM-optimized AI engine inside each memory bank — a storage sub-unit — enabling parallel processing and minimizing data movement. When applied to Samsung’s existing HBM2 Aquabolt solution, the new architecture is able to deliver over twice the system performance while reducing energy consumption by more than 70%. The HBM-PIM also does not require any hardware or software changes, allowing faster integration into existing systems. Samsung’s paper on the HBM-PIM has been selected for presentation at the renowned International Solid-State Circuits Virtual Conference (ISSCC) held through Feb. 22. Samsung’s HBM-PIM is now being tested inside AI accelerators by leading AI solution partners, with all validations expected to be completed within the first half of this year. Source Link to comment Share on other sites More sharing options...
Karlston Posted February 17, 2021 Share Posted February 17, 2021 Similar topics merged. Link to comment Share on other sites More sharing options...
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