Disco Bob Posted January 8, 2019 Share Posted January 8, 2019 A new mobile PC platform with 10nm processor Ice Lake Code-named Ice Lake, Intel has unveiled a 10nm Xeon Scalable server processor that is compatible with its upcoming 14nm Cooper Lake, and is expected to ship in 2020. During its CES 2019 press conference in Las Vegas on Monday, Intel also announced a new mobile PC platform with Ice Lake, which integrates its Sunny Cove CPU micro-architecture, instruction sets to push the use of AI and Intel Gen 11 graphics. Ice Lake will support adaptive sync technology and be capable of over 1 teraflop of performance, also integrating Thunderbolt 3 and Wi-Fi 6. The company is expecting its OEM partners to have devices with Ice Lake by the end of 2019. The tech giant added that it has begun shipping Cascade Lake Xeon Scalable processors, to be broadly available in the first half of 2019. PCs with 5G and AI through Project Athena Intel's latest 5G and AI push is Project Athena, an innovation program with new industry specifications for laptops. Intel is expecting the first devices using Project Athena to launch in the second half of 2019, with its innovation partners on the project including Dell, Google, HP, Samsung, Microsoft, Acer, Asus, Lenovo, and Innolux. "Including 5G and artificial intelligence, Project Athena creates a path forward to accelerate laptop innovation through: An annual spec outlining platform requirements; new user experience and benchmarking targets defined by real-world usage models; extensive co-engineering support and innovation pathfinding; ecosystem collaboration to accelerate key laptop component development and availability; [and] verification of Project Athena devices through a comprehensive certification process," Intel said at CES. Lakefield: A hybrid CPU client platform Intel has also provided a sneak peek of its new client platform code-named Lakefield, a hybrid CPU architecture that utilises its Foveros 3D packaging technology. Lakefield has five cores, merging the 10nm Sunny Cove core with four Intel Atom processor-based cores in a small package. "This enables combining different pieces of IP that might have previously been discrete into a single product with a smaller motherboard footprint, which allows OEMs more flexibility for thin and light form factor design," Intel explained. Lakefield is expected to be in production this year. https://www.zdnet.com/article/ces-2019-intel-unveils-10nm-pc-products-for-ai-and-5g/ Link to comment Share on other sites More sharing options...
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