A.lemane Posted September 16, 2014 Share Posted September 16, 2014 Intel Skylake Gets Detailed with TDP, eDRAM and Memory Configurations SHARE: SHARESHARETWEET Adjust text size: ⌖- Intel Skylake leaks with more details Intel has plans of rolling out its new x86 microarchitecture manufactured with 14nm technology, code-named Skylake, sometimes next year. There's plenty of time before this happens, but the guys over at Wccftech are reporting that the details about Skylake’s different variants, including the desktop “S” model, have been leaked, so we’re able to tell you more about their TDPs, eDRAM and Memory configurations. When Intel pushes these chips onto the market, they will be arriving in 4 variants, including the U/Y/H and S models. As mentioned above, the S model will be aimed at desktops, the H is a high-performance processor for mobile and AIO, while the U&Y are ultra-low power systems for mobile. Skylake is based on the 100 Chipset “Sunrise Point” of the “Sunrise Bay platform.” Anyway, now we know that the U and Y variants will integrate the PCH (Platform Control Hub) on the die, while S and H are two-chip solutions (require an external PCH chip). Furthermore, U and Y will come with support for 1 DIMM Slot per Channel, and S and H will support 2 DIMMs per channel. On top of that, DMI 3.0 will take the place of the previous DMI 2.0 interface, so speeds will be bumped up to 8GT/s. Last but not least, we should mention that the IVR (Internal Voltage Regulator) won’t make it into Skylake Processors. Intel is going to provide multiple configurations for the Skylake. For example, Y and U will only come with DDR3 Memory, while H and S will support DDR4 Memory. Let’s see what we can expect.SKL-Y Configuration 1 – 2 cores with GT2 Graphics / LPDDR3 1600MHz Memory Support/ 4W TDPSKL-U Configuration 1 – 2 cores with GT2 Graphics / LPDDR3 1600MHz Memory Support / 15W TDPSKL-U Configuration 2 – 2 cores with GT3e Graphics plus 64MB of eDRAM / LPDDR3 1600Mhz Memory / 28W TDPSKL-H Configuration 1 – 4 cores with GT2 Graphics / DDR4 2133MHz Memory Support / 35W TDPSKL-H Configuration 2 – 4 cores with GT4e Graphics / DDR4 4133MHz Memory Support / 128MB eDRAM / 45W TDPSKL-S Configuration 1 – 2 cores with GT2 Graphics / Dual Memory / Dual TDPSKL-S Configuration 2 – 4 cores with GT2 Graphics / Dual Memory / 95W TDPSKL-S Configuration 3 – 4 cores with GT4e Graphics / Dual Memory with 64MB of eDRAM / Dual TDP The dual TDP system has 35W and 65W designs. Some of these designs might see some changes at some point, but this is not such a big possibility. So we expect to see Skylake next year! Link to comment Share on other sites More sharing options...
rudrax Posted September 16, 2014 Share Posted September 16, 2014 It's a Technology news Link to comment Share on other sites More sharing options...
Mr Orus Posted September 16, 2014 Share Posted September 16, 2014 * Topic moved. :) Link to comment Share on other sites More sharing options...
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