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  1. AMD triples Zen 3 CPU cache using 3D stacking technology Not a pipe dream—CEO Lisa Su demonstrated a working 3D-stacked 5900X prototype. This exploded diagram shows an additional 64MiB of L3 cache atop the center of the CCD, with structural silicon inserts to either side of the new layer. AMD teased X3D packaging in its Financial Analyst Day a few months ago, but the technology has reached production status much more quickly than expected. AMD CEO Lisa Su holds up a delidded, 3D-stacked Ryzen 5900x processor on stage at Computex 2021. Yesterday at Computex 2021, AMD CEO Lisa Su showed off the company's next big performance play—3D stacked chiplets, allowing the company to triple the amount of L3 cache on its flagship Zen 3 CPUs. The technology is just what it sounds like—a layer of SRAM cache sitting atop the Complex Core Die (CCD) of the CPU itself. Current Zen 3 architecture integrates 32MiB of L3 cache per eight-core chiplet—making 64MiB total for a 12- or 16-core chiplet like the Ryzen 9 5900X or 5950X. The new technology adds an additional 64MiB L3 cache on top of each chiplet's CCD, bonded with through-silicon vias (TSVs). The additional 64MiB L3 cache layer does not extend the width of the CCD, resulting in a need for structural silicon to balance pressure from the CPU cooling system. Compute and cache dies are both thinned in the new design, allowing it to share substrate and heat spreader technology with current Ryzen 5000 processors. Gaming workloads benefit especially from additional L3 cache, as demonstrated by the 12% uplift going from 64MiB to 192MiB in this side-by-side demo. Su claimed 15% average gaming performance uplift for the new technology. Tripling the L3 cache on Ryzen 5000 allows performance gains under some workloads—particularly archive compression/decompression and gaming—similar to those seen with entire new CPU generations. AMD demonstrated performance uplift via a Gears of War 5 demo. Paired with an unspecified GPU and with clock speed fixed at 4 GHz, a current-model 5900X system achieved 184 fps—while the triple-cached prototype managed 206 fps, a gain of roughly 12 percent. AMD claims an average of 15 percent improved gaming performance with the new technology, ranging from a low of 4 percent for League of Legends to a high of 25 percent for Monster Hunter: World. This performance improvement requires neither smaller process node nor increased clock speed—which is especially interesting, in an era where clock speeds have largely hit a wall, and a physics-determined end to process-node shrink seems to be on the horizon as well. Anandtech's Ian Cutress notes that AMD's new 3D chiplet stacking process is clearly TSMC's SoIC Chip-on-Wafer technology in action. While AMD is—at least so far—limiting itself to two layers, TSMC has demonstrated a full 12 layers in action. The problem here is thermal—adding RAM is a near-ideal use of the technology, since the additional silicon doesn't generate much in the way of additional heat. Stacking CPU on CPU would be far more problematic. AMD states that the redesigned 5900X will enter production later this year—well before Zen 4's scheduled launch in 2022. For now, AMD is focusing on the new technology for "high-end Ryzen" CPUs only—no mention was made of Epyc, and the additional silicon required for the added cache makes it a likely nonstarter for budget processors, given current materials shortages. Listing image by AMD AMD triples Zen 3 CPU cache using 3D stacking technology
  2. AMD unveils its third-gen EPYC server CPUs with Zen 3 cores As the company had announced a few days ago, AMD today took the wraps off the third generation of EPYC CPUs, geared towards the server market. These are the first EPYC processors based on the Zen 3 core architecture that debuted with the Ryzen 5000 series, and they promise up to a 19% increase in instructions per clock compared to the previous generation. The lineup includes processors with anywhere from eight to 64 cores, and between 16 and 128 threads, and they include support for things like 4-6-8 channel memory interleaving. AMD is claiming to have the highest performing server CPU - the 64-core EPYC 7763 - as well as the highest performance per core, though that refers to the eight-core EPYC 72F3 in a dual-socket system. AMD shared some performance numbers comparing its lineup to Intel offerings, which show that AMD is ahead in performance in multiple categories, though it's worth noting that the CPUs used in each of the comparisons don't cost the same. For example, the Intel Xeon Gold 6258R costs $3,950 (based on thousand-unit purchases) compared to the $4,860 for the AMD EPYC 75F3 used in the fourth comparison. Here's the full lineup of EPYC 7003 processors: AMD highlighted a number of partners, specifically in the cloud market, including Microsoft Azure, Google Cloud, AWS, and Tencent Cloud, which are all planning to start deploying third-generation EPYC processors. You can learn more about EPYC processors on AMD's website. Soruce: AMD unveils its third-gen EPYC server CPUs with Zen 3 cores
  3. Owners of MSI's 400 series boards will get to upgrade to Zen 3 no matter what modey they own. (Image: MSI) (Image: MSI) AMD previously confirmed that Zen 3 would be compatible with 400-series chipsets. However, there's a caveat to this that has owners for those motherboards nervous. Ryzen 5000 compatibility depends on the motherboard's manufacturer to implement via an updated BIOS. Not all motherboard manufacturers have committed to making their 400-series boards compatible with Zen 3, but one has announced that they'll be doing so with every model. MSI will be bringing Ryzen 5000-series support to its entire line of motherboards with no exceptions. MSI is still determining release details, but the company is targeting January 2021 for the new firmware. This updated BIOS will cover MSI's B450 and X470-series motherboards and allows users to upgrade to a Zen 3 processor once installed. However, the process isn't without caveats. Though MSI hasn't revealed specifics, upgrading a B450 or X470 motherboard to support Zen 3 may involve some compromises. Since many of those boards have limited BIOS memory compared to 500-series boards, the update is a one-way ticket. When the new firmware is installed, some motherboards will no longer be compatible with older Ryzen CPUs, and there will be no option to roll the firmware back. Another disadvantage the B450 and X470 chipsets face is their lack of support for PCIe 3.0. There aren't that many PCIe 4.0 devices available yet, but the latest SSDs, NVIDIA's RTX 3000-series GPUS, and AMD's current and upcoming-gen GPUs all utilize the higher bandwidth for better performance (in theory). MSI's announcement is good news for gamers, who have increasingly found that CPU upgrades usually entail a motherboards swap as well. For enthusiasts that crave the latest and greatest, Zen 3 support for 400-series motherboards means they'll be able to enjoy AMD's upcoming CPUs without breaking the bank. Hopefully, this consumer-friendly move will influence Intel to support more longevity from its chipsets. Source
  4. We may have just got a peek AMD Zen 3 in this Linux kernel update Ryzen 4th-gen desktop CPUs could arrive sooner than we thought (Image credit: AMD) References to Zen 3, the architecture of AMD’s next-gen Ryzen desktop processors, have turned up in the Linux kernel, hinting that these chips might just arrive sooner than we think. New versions of the Linux kernel are often combed through as they emerge, looking for clues like references to unreleased hardware, and this time around it’s Komachi_Ensaka (a prolific leaker) who spotted details of AMD’s ‘Family 19h’ processors, and shared them on Twitter. As Techspot, which reported on the tweet, points out, Family 19h refers to Zen 3 silicon. Zen 2 – the architecture on which existing Ryzen 3rd-gen CPUs are built – is Family 17h. The fact that it’s a new family underlines what we’ve previously heard: that Zen 3 is a whole new architecture, with major gains expected as such. Indeed, some speculation contends that Ryzen 4000 desktop processors might witness a 20% performance leap over and above current Ryzen 3000 products. Which could possibly leave Intel in a difficult position, particularly if its next-gen Comet Lake desktop processors are delayed – with potential issues around power consumption seemingly causing trouble if the rumor mill is right. And certainly something seems amiss somewhere – these CPUs were widely expected to be at least teased at CES, but were a complete no-show. AMD aggression Zen 3 appearing in the Linux kernel doesn’t mean the release of Ryzen 4th-gen chips is around the corner, by any means, but it does hint that perhaps the mid-year point, or just after, could be feasible for release. And if Comet Lake slides to maybe even May, as current speculation holds, that could leave these Intel chips almost immediately facing off against the next-generation of Ryzen. AMD CEO Lisa Su recently confirmed that Zen 3 will definitely be out in 2020, and that the company is going to be “very aggressive” with its CPU roadmap, again hinting that we might see Ryzen 4000 desktop chips sooner rather than later in the second half of the year. Naturally, all of this is merely theorizing on launch timeframes, but Intel is doubtlessly feeling the CPU heat in more than one way right now. The company has already lost enough ground in the desktop processor arena to AMD, without further slipping up. Source: We may have just got a peek AMD Zen 3 in this Linux kernel update (TechRadar)
  5. AMD Zen 3 processors will arrive by March 2021 at the latest And 5nm AMD Zen 4 will follow by 2022 (Image credit: TechRadar) AMD Ryzen 3rd Generation processors have taken over the world, delivering multi-core performance unlike anything we've seen before in the mainstream market. However, AMD isn't going to sit idly by. Instead, at its 2020 Financial Analyst Day, AMD took to the stage and talked a bit about its roadmap, which suggests not only that we'll see AMD Zen 3 processors shown off by this time next year, but that we're getting 5nm processors by 2022. We obviously didn't get a look at any specific AMD Zen 3 specifications at this event – beyond the fact that it will have to use 3D chiplet stacking in future designs – but it's nice reassurance that AMD isn't going to rest on its laurels while it enjoys its newfound leadership status in the desktop CPU market. This is especially refreshing, of course, as we were initially expecting to see AMD Zen 3-based AMD Ryzen 4000 processors for desktop make their debut at CES 2020. This is a bit of a double-edged sword, however, because it does mean that we could be waiting until October to see new desktop processors from AMD emerge, making it the widest gap between AMD Ryzen processors we've seen yet. Still, AMD took a minute to brag that it's shipped more than 200 million Zen Cores since first-generation Ryzen hit the streets, so we're sure AMD is eager to get more processors to market. Either way, the fact that we know AMD Zen 3 processors will be hitting the streets by March next year is helpful, even if AMD didn't help narrow the window any further. AMD will share Zen 3 availability information when it's ready, so until then we're just going to have to wait. Source: AMD Zen 3 processors will arrive by March 2021 at the latest (TechRadar)
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